เป็นซิลิโคนชนิดพิเศษ ตัวเนื้อผสมผลึกเพชรสังเคราะห์ ช่วยเพิ่มการถ่ายเทความร้อนระหว่างCPUหรือVGA กับHeatsinkระบายความร้อน
ตัวซิลิโคนจะมีความเหนียวมาก การใช้งานต้องใช้แบบระมัดระวัง
IC Diamond ® Thermal Compound
IC Diamond is truly an outstanding thermal product with the combined attributes of ultra
-high performance and high durability. IC Diamond lasts 3X
-4X longer than your typical retail compound. On independent tests and reviews by over 900 over clockers on 24 websites, IC Diamond out performed all previously installed user compounds.
Eleven PC Hardware sites conducted competitive comparisons of thermal compound performance. All comparisons highlight IC Diamond thermal paste’s top tier performance characteristics
Applications‎
IC Packaging Heat Conduction
Battery Thermal Management‎
LED Lighting Thermal Management
‎Heatsink
-Thermal Interface
-Non Bonding‎
Innovation Cooling provides custom repackaging services for our commercial customers – Inquire here
Data Sheet
IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heat sink by taking advantage of diamond’s superior thermal conductivity.
Purified synthetic diamond has a thermal conductivity of 2,000
-2,500 W/mK compared to 406
-429 W/mK for pure silver.
Diamond’s five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non
-conductive and non
-capacitive.
Key Features
Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 92% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
Superior bulk conductivity
Excellent thermal impedance
Tight particle distributions
< 40 µ maximum particle diameter
Silicone free
Lower viscosity
Greater stability
Non capacitive or electrically conductive